Role of Additives for Copper Damascene Electrodeposition
نویسندگان
چکیده
منابع مشابه
The chemistry of additives in damascene copper plating
Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. Extensive study over the last two decades has provided researchers with an understanding of the underlying mechanisms. The role of cuprous intermediates in the copper depositio...
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2004
ISSN: 0013-4651
DOI: 10.1149/1.1649235